可扩展毫米波集成天线阵列关键技术研究

With the trend in development of the miniaturized, high-density and large-scale antenna integrated millimeter-wave systems, this project focuses on the study of the scalable millimeter-wave integrated antenna array technology for the problems of the integrated antenna poor radiation performance, poor consistency and bulky size and high insertion loss of the antenna feeding network. Firstly, based on the package substrate, the scalable integrated microstrip antenna element is studied, focusing on the breakthrough of the integrated microstrip antenna broadband and miniaturized key technologies to overcome the narrow bandwidth and bulky size problems of the integrated microstrip antenna. Secondly, the basic interconnects scientific problems, such as the loss property, parasitic effect, impedance characteristic, transmission line effect, etc., is studied at millimeter-wave frequencies. A millimeter wave accurate, scalable and passive memory-dependent RLGC equivalent circuit model is proposed, making a breakthrough in the low-loss millimeter-wave horizontal and vertical interconnects key technologies, and providing a reliable theoretical basis and technology guidance for millimeter-wave antenna integration. Thirdly, the scalable millimeter-wave integrated antenna array technology based on hybrid SIW and microstrip feeding structure is studied to break through the antenna subarray splicing technology and overcome the bulky size, low transmission efficiency and high near-field coupling problems of the integrated antenna feeding network, which providing technical support and theoretical basis of the large-scale millimeter-wave antenna integration.

本项目面向毫米波系统微型化、高集成度及大规模天线集成的发展趋势，针对集成天线辐射性能差、一致性差及集成天线馈电网络尺寸大、损耗高等问题，开展可扩展毫米波集成天线阵列关键技术研究。研究基于封装基板的可扩展平面集成天线单元，重点突破平面集成天线宽带、微型化关键技术，解决集成天线尺寸大、带宽窄等问题。研究互连结构在毫米波频段的损耗特性、寄生效应、阻抗特性及传输线效应等基础科学问题，提出毫米波准确的、可伸缩的、无源化的记忆依赖型RLGC等效电路模型，突破低损耗毫米波水平互连、垂直互连关键技术，为毫米波天线集成提供可靠的理论基础和技术向导。研究基于SIW、微带混合馈电结构的可扩展毫米波集成天线阵列技术，突破可扩展天线阵列集成的子阵拼接关键技术，解决集成天线馈电网络尺寸大、传输效率低、近场耦合大等问题，为毫米波大规模天线集成提供技术支撑和理论依据。

本项目面向毫米波系统小型化、高集成度及大规模天线集成的发展趋势，针对集成天线辐射性能差、一致性差及集成天线馈电网络尺寸大、损耗高等问题，开展可扩展毫米波集成天线阵列关键技术研究。本项目基于IPD、LTCC工艺，研究了D263T玻璃基板、陶瓷基板在毫米波频段高频特性。通过谐振环、传输线技术，提出了借助计算机辅助优化的材料参数自动拟合技术，有效提取了封装基板在毫米波频段的相对介电常数及损耗因子，并与测试结果进行了比较分析。研究了端射、面射天线在毫米波频段的辐射机理、表面波效应、天线间的耦合机制，提出了微型化、高性能、可扩展的60GHz集成天线，并进行了加工及测试验证，天线尺寸仅为3.4 mm×4 mm。研究了互连结构参数对阻抗、损耗、能量泄露、近场耦合、多模抑制特性的调节机制，提出了基于倒装焊互连技术的等效电路模型及宽带低损耗补偿结构。进一步基于2.5-D QFN封装技术，通过天线、互连与芯片协同设计，实现了应用于W波段生命探测雷达的新型共面波导集成阵列天线，并与系统进行了联合测试验证。提出了采用盲孔堆叠形式的立体电磁偶极子结构，并利用振子折叠的方式实现立体天线的低剖面和微型化。进一步实现了基于2×2可扩展子阵拼接技术的60 GHz 16元相控阵封装天线，并进行了加工及实验验证，为毫米波大规模天线集成提供技术支撑和理论依据。