毫米波亚毫米波集成天线设计方法与性能优化技术研究

As potential solutions of the requirement of high-data-rate broadband wireless communication, millimeter and sub-millimeter wave technologies have been greatly investigated. Their highly integrated systems are preferred to fabricate by using low cost mainstream silicon technology, in which the integration of high performance antenna and circuit is a design bottleneck. Efficiency of antenna on chip (AoC) based on mainstream silicon technology is very low and the most improved methods are expansive or incompatible. Fabrication process of antenna in package (AiP) can destroy active devices in the package and interconnection between antenna and die is a challenge. Recent research shows that substrate integrated waveguide (SIW) is a better transmission structure than microstrip and coplanar waveguide at millimeter and sub-millimeter wave frequency because there is no electromagnetic shock wave in SIW for its closed structure. In this proposal, low cost high efficiency AoC and AiP using SIW technology for millimeter and sub-millimeter wave applications will be investigated based on mainstream silicon technology and its compatible process. Precise electromagnetic parameters of different materials at millimeter and sub-millimeter wave frequency will be characterized. Electromagnetic full wave algorithm rectified by using typical parameters as variables will be presented to analyze SIW components. Working mechanisms of AoC and AiP based on SIW structure will be studied and their design methods will be developed. Performance optimized methods including efficiency improvement, bandwidth enhancement and size reduction will be investigated and low loss interconnections for these novel AoC and AiP will be designed.

毫米波亚毫米波通信技术作为可满足未来高速宽带无线通信需求的可行技术而受到极大关注，基于主流硅技术的高度集成系统是实现其低成本开发的首选途径。高性能天线集成是系统集成的瓶颈，基于主流硅技术的片上集成天线效率低且大部分改进技术成本高昂，封装集成系统中天线加工对封装内有源器件影响显著且天线与管芯的互连损耗大。有研究表明在毫米波亚毫米波频段，基片集成波导因具有抗电磁冲击效应而比微带线和共面波导等开放式平面传输线有更好的传输特性。本项目将以主流硅技术及其兼容工艺与基片集成波导结合，研究毫米波亚毫米波频段的低成本高效率片上集成天线和封装集成天线。探索主流硅技术及其兼容工艺条件下材料电磁参数的精确表征方法；提出由典型参数作为变量修正的高效建模方法对基本导波结构进行全波分析与刻画；获得适用于片上集成和封装集成的基片集成波导天线的设计方法，揭示其工作机理并研究相应性能优化技术。

毫米波亚毫米波通信技术作为可满足未来高速宽带无线通信需求的可行技术而受到极大关注，基于半导体技术的高度集成系统是实现其低成本开发的首选途径，其中高性能天线集成是系统集成的瓶颈。本项目主要研究了基于CMOS工艺和InP工艺的毫米波亚毫米波集成天线设计方法与辐射效率提升技术；推导了多天线应用场景的天线隔离度设计理论，在此基础上实现了圆极化天线的轴比波束调控方法和工作频带展宽方法；研究了基于周期性结构实现的超材料、慢波结构和人工磁导体等实现线极化和圆极化等不同类型天线的频带展宽；研究了采用微带和基片集成导波结构等不同传输线形式实现不同类型的巴特勒矩阵网络，从而实现对天线方向图的调控；设计基于层叠平板波导的三维频率选择结构，实现了频率响应特性极为稳定、带外吸波特性更高的新型天线罩。