基于硅基芯片的超大容量光通信关键技术研究

This project will build ultrahigh capacity coherent and direct detection optical communication systems with high-speed optical modulation and multi-dimensional multiplexing based on Silicon chip and will study the key technologies in three aspects. (1) Optical transmitter and receiver on Silicon chip: studying the design of Silicon modulator with high bandwidth and high linearity, investigating the nonlinearity compensation of Silicon modulators with plasma dispersion effect, studying the mechanism of high-speed and linear modulation; studying electrical pre-distortion/pre-equalization and optical pre-equalization to mitigate the nonlinearity and the bandwidth limitation of Silicon modulator; investigating high bandwidth Silicon optical receiver for both coherent and direct detection systems with polarization division multiplexing (PDM). (2) Silicon chip with multi-dimensional multiplexing: studying the coordinated design of wavelength division multiplexing (WDM), mode division multiplexing (MDM) and PDM, studying multi-port dense WDM device, MDM and PDM devices with high optical bandwidth. (3) Ultrahigh capacity optical communication systems based on Silicon chip: realizing single wavelength PDM 400Gb/s multilevel quadrature amplitude modulation (QAM) and 200Gb/s multilevel pulse amplitude modulation (PAM) with Silicon modulator, validating in principle the capability of 100Tb/s coherent detection and 50Tb/s direct detection multi-dimensional multiplexing optical communication systems based on Silicon chip. The expected accomplishments can lay a solid foundation for the development of high-speed Silicon photonic transmitter/receiver chip and ultra-high capacity Silicon optical communication technologies.

本项目将构建基于硅基芯片的高速光调制、多维复用与相干/直接检测超大容量光通信系统，开展三个方面的关键技术研究。（1）硅基发射接收芯片：研究高带宽高线性度硅基光调制器设计方案和基于等离子体色散效应的硅基调制器非线性补偿特性，探索高速线性调制机理；研究电预失真/电预均衡和光学预均衡技术补偿调制器非线性和带宽限制；研究高带宽偏振复用相干/直接检测硅基光接收机。（2）硅基多维复用芯片：研究硅基波分复用、模分复用与偏振复用协同设计方法、多端口密集波分复用器件、高光学带宽模分复用与偏振复用器件。（3）基于硅基芯片的超大容量光通信系统：基于硅基调制器实现单波长偏振复用400Gb/s多进制正交幅度调制和200Gb/s多进制脉冲幅度调制，完成总容量100Tb/s相干检测和50Tb/s直接检测多维复用硅基光通信系统原理性验证。预期研究成果将为高速硅基光发射接收芯片和超大容量硅基光通信技术的发展奠定坚实基础。

本项目以基于硅基芯片的超大容量光通信关键技术为中心开展科研工作，取得了以下主要成果。项目组建立了完整的硅基芯片高速光传输测试平台。研制了多种硅基调制芯片，包括硅基强度调制芯片和IQ调制芯片，实现了400Gb/s偏振复用16QAM硅基光调制。实现了单通道单偏振200Gb/sPAM6硅基强度调制，创造硅基强度调制芯片光互连最高速率纪录,研究成果在光通信顶级学术会议OFC2019作为PDP论文发表。基于锗硅电吸收调制器实现了160Gb/s16QAM副载波信号和PAM4信号2km标准单模光纤传输。基于硅基强度调制器，实现了168Gb/s单边带信号传输80km，进一步实现184Gb/s硅基调制单边带信号传输320km，176Gb/s硅基调制单边带信号传输400km。基于硅基IQ调制器，实现204Gb/s硅基调制单边带信号传输80km。实验证明硅基调制芯片可用于直接检测高速光互连和城域光传输系统。研制了高效率硅基石墨烯电光相位调制器，提出了基于螺旋线型马赫曾德尔结构的石墨烯硅基调制器、大容差新型微盘石墨烯调制器。提出了基于氧化锡铟的硅基单波导双偏振电光强度调制器结构、硅基偏振不敏感电光强度调制器、硅基电光可调超表面。研制了一种低功耗硅基差分接收机，研制了硅基偏振复用相干检测和斯托克斯直接检测接收机。研制了硅基偏振复用Kramers-Kronig相干接收机，硅基光探测器带宽约34GHz，实现了256Gb/s偏振复用16QAM信号检测。研制了一种基于桥型耦合器和椭圆形模式转换器的大工艺容差模式复用芯片。提出了采用串联的级联微环的结构来实现64通道复用，实现了64个信道的波分复用器件，实验证明支持60Gbaud的16QAM和PAM4信号波分复用。研制了2个正交偏振态TE和TM共8个模式的模式复用芯片，实现50Gbaud的16QAM和PAM4信号模分复用。结合波分复用和模分复用，硅基相干检测系统传输容量达到100Tb/s量级，硅基直接检测系统传输容量达到50Tb/s量级。项目成果将为高速硅基光调制接收芯片、硅基多维复用、超大容量硅基光通信等技术奠定坚实基础。