铝基均热板梯度吸液芯结构激光能量调控烧结成形及传热性能

Electronic device miniaturization, lightweight, high integration development in aerospace field leads to the challenge of high heating flux in narrow heat dissipation space. We proposed a novel aluminum vapor chamber (AVP) with gradient wick structure. This project mainly focuses on the manufacturing theory and method of the wick structure in the aluminum vapor chamber, which is the core technology in this field. Based on the active design of the gradient wick structure, we would like to get the combined design method of the heat transfer performance of the AVP, structure parameter of the wick structure and the micro mophology in the wick structure. According to the characteristics of the laser energy regulate sintering (LERS) technology, realize high-efficient and low-cost manufacturing method of the gradient wick structure. Reveal the basic principle of the aluminum powder laser energy regulate sintering and research the influence of the technological parameter of LERS on the geometrical parameter of the wick structure based on the morphology characterization, numerical analysis, microscopic observation and performance testing methods. Explore the encapsulation process of the AVP, make some samples with different specifications, research the influence of the wick structure parameters, filling ratio, encapsulation parameters on the heat transfer performance of the AVP. Do our best efforts to provide high performance heat transfer device with proprietary intellectual property rights in the field of electronic chip thermal control, and provide technical support for the progress of high-performance electronic chip industry.

本项目针对我国航空航天领域高性能电子芯片小型化、轻量化、高集成度带来的狭小空间高热流密度热控难题，提出了一种新型的具有梯度吸液芯结构的铝基均热板。本项目重点围绕铝基均热板的核心技术-梯度吸液芯微结构制造理论及方法开展研究；以梯度吸液芯的主动功能设计为突破口，实现铝基均热板传热性能、吸液芯结构特征以及表面微观形貌的耦合设计；结合激光能量调控烧结成形技术特点，实现吸液芯结构的高效低成本制造；通过形貌表征、数值分析、微观观察与性能测试等手段，揭示铝粉末激光能量调控烧结成形技术的成形机理，研究工艺参数对梯度吸液芯几何结构和表面形貌的变化规律的影响；探索铝基均热板封装工艺，制成不同规格的均热板样品，研究吸液芯结构参数、灌注量、封装参数对铝基均热板传热传质性能的影响机理。为我国电子芯片热控制领域提供具有核心自主知识产权的传热元器件，为高性能微电子芯片产业的发展提供技术支持。

本项目针对我国航空航天领域高性能电子芯片小型化、轻量化、高集成度带来的狭小空间高热流密度热控难题，提出了一种新型的具有梯度吸液芯结构的铝基均热板。本项目以铝基均热板及其吸液芯结构为主要研究对象，开展了包括吸液芯结构设计，数学建模，结构表征，工艺优化，性能测试，工程应用等方面创新性基础研究工作。提出铝基均热板梯度吸液芯结构激光能量调控烧结成形技术，制备了高性能铝基均热板，建立了吸液芯结构毛细上升理论模型，搭建实验平台测试了毛细性能、传热性能，解决了铝基均热板高效低成本制造问题，掌握了铝基均热板制造、表征、性能测试综合评价方法。同时，在课题研究基础上，探索了铝基金属纤维吸液芯结构的高温固相烧结技术，仿生微沟槽吸液芯结构激光加工成形技术，研究了两种吸液芯结构毛细性能。最后，基于本项目的研究内容，采用激光加工方法制备了温度传感器，金属微纳米颗粒，制造了梯度多孔微针阵列，仿生仙人掌针刺结构，并研究了其在生物医学领域的应用。本项目的研究工作可为我国电子热控领域提供高性能传热元件与技术支持。项目立项至今，已在国内外相关学术期刊发表论文4篇，其中 SCI 收录论文4篇；申请发明专利4项；培养硕士研究生2名。综上，项目按原计划进行，完成了预期研究目标。