基于薄膜集成无源元件技术的超小尺寸高性能射频无源模块实现的研究

Recently, requirements of integration and system performance for RF integrated circuit have been highly improved, especially for the passive devices which play an important role in the whole RF system. Therefore, reducing the fabrication cost and decreasing chip size of passive components while remaining excellent performance is becoming a technique issue waiting to be urgently conquered. Comparing the currently existed research methods, instead of exploiting from the fundamental, almost all of them are dedicating in the reconstruction of proposed layout using existed chip circuits which have developed using fabrication process of basic components. Given this, this proposed project is the first to put forward the idea of regarding the development of basic components, which are capacitor and inductor, as the breakthrough point to achieve better performance and effective cost. Not only will the optimization of critical parameters of capacitor and inductor be carried out, but also the study of advanced fabrication process, finally a specifically feasible blue print can be summarized. On the basis of the fulfillment of optimized and fabricated components, novel structure and miniature layout of the integrated passive device and module can be designed and fabricated both with excellent performance and ultra-compact size. In this proposed study, feasible plans to optimize the performance of capacitor and inductor as well as their operation mechanism will be exploited, laying a theoretical foundation and instance reference for the design and fabrication of advanced integrated passive device and module, hopefully inspire the development of integrated passive device technology in the future.

当前，射频集成电路的集成度与系统性能要求大幅度提升，特别是对在整个射频系统中占据主要地位的无源器件部分，那么如何在保证无源器件的性能得到提高的同时降低生产成本减小芯片尺寸成为当下急需攻克的一项技术难题。国内外现有研究方法大都是基于底层已开发出的元器件工艺方案通过对顶层芯片级的电路结构重新进行布局布线设计来进行整体性能优化，没有从最根本点出发。鉴于此，本项目拟首先从无源器件最底层基本元件电容和电感为切入点，以优化元件关键参数为目的，研究新型工艺流程，获取提升元件性能的具体可行性方案。然后基于已优化出的基本元件运用新颖的布局布线设计研究出具有高性能超小尺寸的集成无源器件和集成无源模块。通过本项目研究，探索出提升电容与电感性能的可行性方法、明细各方法对影响元件性能的原理，并为具有先进性的集成无源器件及模块设计提供理论实验基础以及实例参考，该研究对推动集成无源元件技术发展具有重要意义。

项目针对于当下在集成无源器件领域无法实现在芯片性能得到提高的同时实现芯片尺寸减小、芯片生产成本降低的这一难以攻克的技术难题，开展了一系列的系统性的科学研究。项目中首先从无源器件最底层基本元件电容和电感为切入点，以优化元件关键参数为目的，研究出了新型工艺流程，获取了提升元件性能的具体可行性方案。具体说来，针对于电容的研究，以改善电容漏电流特性、击穿电压特性以及电容密度特性为具体目标，找到了提升电容性能在工艺优化方面可使用的最有效优化方法；建立了提升电容器稳定性的可行性方案；解决了以钛酸钡薄膜作为电容介质层所面临的薄膜刻蚀速率，膜内缺陷态, 膜质待提升等问题。针对于电感的研究，以空气桥、空气桥墩、过孔等普通电感结构为基础，建立出了具有高耦合效应的双层空气桥架构的新型电感模型，并开发出了此模型下的新型加工工艺；创建出了以钛酸钡薄膜为基础的“超材料”，并依托该“超材料”获得电感品质因数最优化的量化模型。然后，基于已优化出的电容、电感元件，运用新颖的布局布线设计研究出了具有高性能超小尺寸的集成无源器件（带通滤波器）4种和集成无源模块（平衡滤波器）1种。通过本结题项目的顺利实施，探索出了提升电容与电感性能的可行性方法，明细了各方法对影响元件性能的原理，并为具有先进性的集成无源器件及模块设计提供了理论实验基础以及实例参考，该研究对推动集成无源元件技术发展具有重要意义。.在基金的资助下，已发表学术论文21篇，其中SCI检索期刊论文20篇，EI检索会议论文1篇，已授权发明专利3项，实质审查阶段中发明专利11项。超额完成了项目预定的研究目标。