强静电场作用下离子导电聚合物和金属键合机理与界面组织性能表征

Ionic conductive polymeric materials with excellent performances, a new MEMS packaging bonding material, can not only improve the electrical performance of the electronic package, decrease the bonding temperature, reduce the residual stress of package bonding, but also improve the quality of microelectronic device packages. Based on the single and the multiple (3 and 5) layers packaging technology of P(EO)n-LiX ion conductive polymer solid electrolyte and metal (as Al,Si etc) materials, this project is intending to design and fabricate the ion conductive polymer solid electrolyte that can be bonded with metal Al etc; the laws of the anodic bonding and that polarization matrix chain segment movement promoting lithium-ion movement in the amorphous region of ion conductive polymer solid electrolyte in the intense electrostatic field will be investigated; the transfer thermodynamic conditions and dynamics, and mechanisms of gathering and bonding of charged particles in the bonding process of the ion conductive polymer material and the metal will be analyzed; the electrochemical reaction characteristics of the bonding interface and the bonding mechanisms will also be investigated; and microstructure and property of the bonding interface between the ion conductive polymer and metals in the strong electrostatic field will be characterized; the bonding temperature, stress and strain distributions in the cooling process, as well as the impact on the quality of the bonding will be studied also. The investigation results will promote the application of polymeric materials in microelectronic industry. It has an important scientific significance and application value.

采用性能良好的离子导电聚合材料作为新型的MEMS封装键合材料，可改善电子封装电性能，降低键合温度，减小封装残余应力，提高微电子器件封装的质量。本项目拟以P(EO)n-LiX系离子导电高分子固体电解质和金属类（Al、单晶硅等）材料的单层和多层（3和5层）封装技术为背景，设计制备适合与金属Al等材料键合的离子导电高分子固体电解质；研究强静电场下离子导电高分子固体电解质非晶区域中受极化基体链段运动促进锂离子的移动及其键合的规律；离子导电聚合物材料与金属键合过程中的荷电粒子传输热力学条件和动力学过程、荷电粒子的聚集和键合机制；键合界面的电化学反应特征及其键合机理；键合界面生成物微观组织结构特征和界面性能表征；键合冷却过程中温度和应力应变分布规律，以及对键合质量的影响。研究成果将有效的促进离子导电聚合物材料在微电子行业更好的应用，具有重要的科学意义和应用价值。

封装是复杂MEMS制造的重要环节之一，直接影响MEMS使用寿命和应用范围。MEMS封装技术一直是困扰MEMS器件开发和实用化的关键技术之一，MEMS 器件可靠性很大程度上取决于封装的质量。高分子固体电解质作为新型的MEMS封装材料，可改善电子封装电性能，降低键合温度，减小封装残余应力，提高微电子器件封装的质量。项目申请人以聚氧化乙烯(PEO)和高氯酸锂（LiClO4）单质粉体为原料，采用高能球磨法制备了不同络合比的阳极键合用离子导电聚合物PEO-LiClO4键合材料, 并利用X 射线衍射、示差扫描量热法DSC和紫外吸收光谱测试分析等方法对PEO与LiClO4的络合机理进行了研究。研究结果发现，随着高氯酸锂的加入并增加其含量，有效的阻碍了PEO的结晶，使得无定形区的PEO-LiClO4 含量增加，络合程度不断提高，室温电导率也越高；键合分析表明较高的电导率使得PEO-LiClO4与金属铝的键合率更高，键合质量越好；通过运用有限元分析发现，三层键合件结构对称性的特点使得其变形量比两层键合件的变形量更小。项目资助共发表论文13篇，其中SCI收录5篇，EI收录2篇，专利获批2项。培养博士3人，硕士5人，其中4人已经取得硕士学位。