基于FOLED封装的高分子电解质/金属超声辅助阳极键合机制及关键技术研究

The flexible organic light-emitting devices (FOLED) is a potential new generation display with broad development prospects. The key technology for improvement stability and lifetime of FOLED lies in the effective encapsulation of the device. On the basis of the previous research, the applicant proposed a new method using ultrasonic-assisted anodic bonding technology for the first time to design and prepare the new composite solid polymer electrolytes materials which is suitable for ultrasonic-assisted bonding of aluminum and other materials. The prepared materials must meet the requirements of FOLED on the oxygen and moisture resistance, electrical conductivity and luminousness. The effect of acoustic cavitation and acoustic eddy currents on the surface of the composite solid polymer electrolytes was studied when the ultrasonic waves acted on the interface. The mechanism of charge-particle transport, aggregation, and bonding at the interface was revealed under ultrasound-assisted process conditions, and the thermodynamic conditions and kinetic characteristics of the bonding interface reaction under the electric field were determined. By characterizing the microstructure of the interfacial product, the best process parameters for ultrasound-assisted anodic bonding encapsulation at low energy ultrasound and low electric field strength were obtained. This research results will effectively promote the wider application of new materials and new methods in the microelectronics industry, and have important scientific significance and application value for improving the encapsulation quality of FOLED devices.

柔性有机电致发光显示器件（FOLED）是具有广阔发展前景的新型显示器件，对其进行有效封装是提高其稳定性和寿命的关键。项目申请人在前期研究基础上，针对目前FOLED封装材料以及封装工艺的不足，首次提出采用超声辅助阳极键合封装技术，设计并制备适合与金属铝等材料超声辅助键合封装的复合高分子固体电解质材料，并在性能上满足FOLED对封装材料水氧阻隔性、电导率、透光率等要求。研究超声波作用于连接界面时在超声能量下产生的声空化作用和声涡流作用对复合高分子固体电解质表面的活化作用。揭示在超声辅助条件下，连接界面的荷电粒子传输、聚集和键合机制，确定在电场作用下键合界面反应的热力学条件和动力学特征。通过表征界面生成物的微观组织结构，获得低能超声和低电场强度下超声辅助键合封装的最佳工艺参数。研究成果将促进新材料新方法在微电子行业更广泛的应用，对提高FOLED器件封装质量具有重要的科学意义和应用价值。

针对目前FOLED封装材料以及封装工艺的不足，首次提出了采用超声辅助阳极键合封装技术新方法，设计并制备适合与金属铝的超声辅助键合封装的复合型聚合物固体电解质材料；研究超声波作用于连接界面时在超声能量下产生的声空化作用和声涡流作用对复合型聚合物固体电解质表面的活化作用；揭示在超声辅助工艺条件下，连接界面的荷电粒子传输、聚集和键合机制；确定在电场作用下键合界面反应的热力学条件和动力学特征；通过表征界面生成物的微观组织结构和性能，获得低能超声和低电场强度下超声辅助阳极键合封装的最佳工艺参数。研究结果表明：30-35um振幅的超声辅助作用能有效的增大键合电流，提高键合强度。通过超声摩擦去除材料表面的氧化物和杂质，使材料的键合界面软化，并得到有效验证，这与高温在阳极键合过程中的作用（软化界面的微观层，实现电解质材料表面微观峰的蠕动滑移，促使金属-固体电解质材料结合界面达到静电力的距离）具有相同的功能，通过配置不同共振频率的电隔离换能器，将超声波焊接和阳极键合两种工艺相结合，不仅能获得好的键合强度和保证器件的可靠性，而且还能降低成本，提高生产效益，实现高效、优质的封装。本项目研究成果将有效促进聚合物材料在微电子器件以及光伏器件的柔性封装环节的应用，保证封装可靠性，延长器件使用寿命具有重要的科学意义及应用价值。