光电子封装的柔性并联运动设计与控制研究

Optoelectronic device is an important support for the rapid development of the next generation technology of fibre optical communication. And the alignment accuracy between optical fibers and chips is the main factors that influencing the device performance when packaging. Considering the multiple degree of freedom (12 dimensional motion), the centimeter stroke and the submicron accuracy of alignment motion in the photoelectron packaging, this project aims to research the formation mechanism and control method of flexible parallel motion with centimeter stroke and submicron precision in the optoelectronic packaging.　First, the stroke and accuracy of each dimension is identified, and the design concept of the flexible parallel motion that is suitable for optoelectronic packaging is proposed, by studying the coupling characteristics and the rule of accuracy loss in multi-dimensional complicated motion of optoelectronic packaging, Secondly, a new flexible parallel motion with centimeter stroke and submicron accuracy is studied, and then the design of 12-dimensional flexible parallel motion of optoelectronic package is conducted, by revealing the unique motion characteristics of optoelectronic packaging motion - "big stroke with micron accuracy and small stroke with submicron accuracy". Finally, the coupling rules among motion channels is found out, and the nonlinear decoupling control of the multi-dimensional motion is implemented by studying the kinetic characteristics and dynamics modeling of the flexible parallel motion. Thus, the high-performance optoelectronic packaging alignment movement is realized. The research achievement will provide a powerful theory and technology support for our national manufacturing technology and package equipment of next-generation photonic integrated devices.

光电子器件是下一代光纤通信技术快速发展的重要支撑，而封装过程中光纤与芯片的对准精度是影响器件封装性能的主要因素之一，针对光电子封装中对准运动的多自由度（12维运动）、厘米行程、亚微米精度等特性，本项目拟开展用于光电子封装的厘米行程亚微米精度柔性并联运动的生成机理与控制方法研究。通过对光电子封装多维复杂精密运动的耦合特性、精度传递规律等研究，确定每维运动的行程与精度要求，实现光电子封装柔性并联运动的概念设计；揭示光电子封装特有“大行程微米精度+小行程亚微米精度”复合运动特性，探明柔性并联运动的厘米行程亚微米精度生成机理，实现光电子封装12维柔性并联运动的集成设计；研究光电子封装柔性并联运动的动力学特性和动力学建模，查明运动间的耦合规律，实现该多维运动的非线性解耦控制。最终实现高性能的光电子封装对准运动，为我国具有自主知识产权的下一代光子集成器件封装制造技术与装备提供理论基础和技术支持。

光电子器件是下一代光纤通信技术快速发展的重要支撑，而封装过程中光纤与芯片的对准精度是影响器件封装性能的主要因素之一。针对光电子封装中对准运动的多自由度、厘米行程、亚微米精度等特性，本项目分析了光电子封装多维复杂运动的耦合特性、精度传递与精度分配规律，得到了光电子封装运动系统各维运动的行程与精度；研究了光电子封装柔性并联运动的厘米行程亚微米精度生成机理，提出了一种柔性并联运动，适用于光电子封装中的对准运动；针对光电子封装运动的复杂性和特殊性，开展了六自由度串并联混合驱动精密运动平台的结构设计，较之前的纯并联柔性六维运动系统更合适光电子封装中的对准运动；采用了一种基于弹性运动学的逆运动学建模方法，实现了具有大变形柔性铰链的柔性并联平台的逆运动学建模。基于上述逆运动学模型，用仿真分析的方法，对平台进行了工作空间分析，刚度分析，并对其进行了优化改进，获得了平台的结构参数。制作了光电子封装用六维柔性并联运动系统，并开展了调试工作；开展了光电子封装对准实验研究，实验结果表明柔性并联平台基本上可以满足同轴型耦合对准运动的要求。针对柔性并联运动的关键部件-底层驱动电机，开展了精密微驱电机的研究，研发了几种适合柔性并联运动的直线型驱动电机；开展了二型模糊控制算法的研究，开展了多自由度并联运动的非线性解耦控制研究。另外，以第一作者或者通讯作者发表SCI论文8篇，申请专利14项。为我国具有自主知识产权的下一代光子集成器件封装制造技术与装备提供理论基础和技术支持。