电子薄膜传热性能测量及分析研究

The thermal performance of thin films governs the heat transfer characteristics and reliability of the microelectronic devices. This project provides a new method that can measure the thermal conductivity, emissivity, specific heat capacity and thermal diffusivity of thin films simultaneously, founds the steady and transient heat transfer models of the test samples, establishes the first experimental setup for measuring the thermal properties of thin films in domestic scope. We have obtained the reliable thermal properties of SiNx, SiO2 and Al2O3, and analysed the effects of the temperature and thickness of thin films on the thermal properties. With numerical simulation method from the obtained thermal properties data, we have computed the temperature and thermal strain fields of SiNx X-ray mask in the bake process of different methods. The computed results accords with the experimental. The research production of this project can provide scientific basis for the design of microelectronic circuits and the execution of technical process.

薄膜传热性能对微电子设备的传热能力及其性能和可靠性有重大影响。本课题依据抟热学理论，建立薄膜试样在稳态和瞬态下传热的数学模型，采用实验测量和理论分析相结合的方法，获得薄膜导热系数、发射率、热扩散、温度及比热的计算公式，并进一步研究薄膜厚度、温度及淀积方法对薄膜传热性能的影响。研究成果可为微电子电路的设计和发展提供科学依据。