In this research, Scratch method, indentation method and nanoindentation method are used tostudy the interfacial adhesion of hard film on soft substrates, soft film on hard substrates and film.without obvious interface. This work provides mechanical mechanism for scratch method measurement of interfacial adhesion and theoretical foundation for inner connection between actual parameters and interfacial adhesion. After analyzing the change of stress and stress field.near the interface during scratching, we find that the maximal shearing stress leading to surface stripping is located in contact radius that deviates the axisymmetric center. However, maximal.tensile stress, which is twice of that when loading, is located in the elasto-plastic border. Themaximal tensile stress results in the surface stripping during unloading. Nanoindentation method.is especially studied to characterize the interfacial adhesion of film without obvious interface.Good condition is established to evaluate interfacial adhesion of various film/substrate.
采用划痕法、压痕法、动态拉伸法、擦膜法和横截面上的超显微硬度研究,并结合计算机模拟研究各类膜层样品的动、静态界面结合强度,以搞清划痕法和压痕法的力学机制和实测参量与界面结合强度的内在联系,为研制新的较理想的界面结合强度测试方法创造条件。这样,实验和理论分析两者相辅相成,企图走出一条研究薄膜材料力学性能的新途径。
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数据更新时间:2023-05-31
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