高性能硅基薄壳微半球谐振陀螺仪研究

In order to further realize the traditional inertial-grade hemispherical resonant gyroscope miniaturization, based on the possession of middle-high performance and navigation integral error in full angle mode, in this proposal, the hemispherical resonator driven by the high frequency signal is utilized by making full use of body standing wave with properties of little energy dissipation intrinsically, smaller thermal elastic damping and higher quality factor, and under Coriolis effect can make drive and sense modes matching so well to significantly improve the sensitivity and guarantee the necessary bandwidth, which innovatively investigate a novel gyroscope combining the hybrid advantages of the high performance hemispherical resonant gyroscope and integrated micro-gyroscope. Therefore, 3D silicon micromechanical fabrication technology and traditional hemispherical resonant gyroscope technology are comprehensively utilized in this research plan, and the design of a new high aspect ratio micro hemispherical resonant gyroscope under micro fabrication technology is presented, which core components are designed by 3D silicon-based processing of sub-micron ultra-thin hemispherical resonator and the internal and external electrodes structure, using the micro assembly to improve the alignment precision between standing wave antinodes and electrodes with less assembly error, and introducing the nano getter to realize the wafer level vacuum packaging. In the full angle mode and angular rate mode, the circuitry simulation models are constructed respectively for drive and sense modes of the hemispherical resonant oscillator to realize high precision low noise measurement and control circuit. Finally the standard set of specification will be measured to implement the micro hemispherical resonant gyroscope mechanism research.

在具备中高性能和全角模式下无角速度积分误差等优越指标基础上，进一步实现惯性级传统半球谐振陀螺仪微型化。本课题采用高频信号激励半球谐振器，充分利用其体驻波能量耗散小、热弹性阻尼小及品质因数高等优点,且在哥氏效应下驱动检测两简并模态完全匹配可显著提高灵敏度和保证必需带宽，创新研究一种兼备高性能半球陀螺仪和集成化硅微陀螺仪优点的新型陀螺仪。为此，本课题综合运用三维硅微机械加工技术和传统半球谐振陀螺仪原理，提出研究一种微加工组装下的高深宽比全新微半球谐振陀螺仪，其核心部件采用三维硅基加工设计的亚微米级超薄等厚半球谐振器和内外环形对称电极结构，利用微组装提高驻波腹点与电极对准精度，降低球壳与内电极关键部件组装误差，引入纳米吸气剂实现晶片级真空封装。在全角模式和速率模式下，分别构建半球谐振陀螺谐振子驱动和敏感检测电路仿真模型和装调高精度低噪声测控电路，进行性能规范测试最终完成微半球谐振陀螺仪机理研究。

陀螺仪是在惯性空间测量运动体旋转角度或角速度的传感器，是除加速度计以外惯性传感器家族的另一个重要大类。在当前的陀螺仪应用中，高精度陀螺仪方面主要有两类：一类是基于萨格奈克效应的各种光学陀螺仪，包含环形激光陀螺仪和光纤陀螺仪等；另一类是基于哥氏效应的谐振陀螺仪，其中精度最高、最具有发展前景的即为半球谐振陀螺仪。硅微机械（MEMS）陀螺仪凭借其所具有的体积小、重量轻、成本低、功耗低且可集成等优点，已经逐步取代了其他类型的陀螺。未来惯性传感器的发展方向可以概括为：高精度、高可靠性、微型化、多轴测量和多功能测量。本项目的研究内容是实现传统半球谐振陀螺仪的微型化，在充分研究分析其工作原理的基础上，创新地研发出一种兼具传统半球谐振陀螺仪高精度的特点和MEMS陀螺仪体积小功耗低等优点的新型微半球谐振陀螺仪。本项目系统分析微半球谐振陀螺仪的工作原理，建立微半球谐振子数学模型，通过Ansys等仿真软件，对能量损耗机理进行分析，优化整体结构。并根据现有MEMS加工工艺设计一套加工工艺流程，加工过程中对工艺参数进行优化并改进结构参数，保证加工过程中微半球谐振子球度及光滑度。同时，根据微半球谐振陀螺仪工作机理仿真设计相应处理电路，运用Matlab/Simulink软件对电路进行仿真优化，完成处理电路制作。初步搭建微半球谐振陀螺仪样机，对模态进行测试，为以后的研究工作奠定了坚实的基础。通过本课题的研究，不仅锻炼了研究队伍，而且还培养了博士硕士研究生，为培养学科发展和基础研究的后备人才提供了积极的作用。