面向三维封装的多模态力电检测与可靠性诊断技术

3D packaging is the most effective way for achieving higher density and more functional integration of electronic systems. As the volume of 3D packages shrinks and the heat flux density increases, the thermo-mechanical and force-electric coupling effects within the package increase, thus directly impact its reliability. In view of the unclear coupling mechanism in the 3D packaging, imperfect testing methods, and inaccurate reliability assessment, the project will establish a system-level packaging force-electrical coupling model based on a precise understanding of the coupled physical mechanism of thermal stress-electromagnetic properties; through in-depth study of multi-modal high-precision space-time decoupling high-precision stress test method, multi-modal force detection framework based on multi physical parameters force-stress correlation model will be constructed to achieve verification and correction of the force-electric coupling model; furthermore, this project will conduct research on packaging fault diagnosis technology by using multi-modal test data fusion, and build a 3D package evaluation and life prediction model with considerations of multi-physical coupling and transfer reliability. This project is of great significance for guiding the high-reliability design and process improvement of the 3D packaging thus assisting the development of the system-level packaging industry.

三维封装是电子学系统实现更高密度和更多功能集成的最有效途径，随着三维封装体积不断减小、热流密度越来越高，封装内部的热-力、力-电耦合效应愈发突出，直接影响其可靠性。针对三维封装中存在的耦合机理不明晰、测试手段不完善和可靠性评估不准确等亟待解决的问题，本项目在准确认识热应力-电磁特性的耦合物理机理基础上，构建系统级封装的力电耦合模型；通过深入研究多模态高精度时空去耦高精度应力测试方法，构建基于多物理量-应力关联模型的多模态力电检测框架，实现对力电耦合模型的验证和修正；研究多模态测试数据融合的封装故障判别技术，构建基于多物理量耦合及传递可靠性的三维封装评估、寿命预测模型。项目的研究对于指导三维封装的高可靠性设计与工艺改进，助力系统级封装行业的发展具有重要意义。

三维封装是电子系统实现更高密度和更多功能集成的最有效途径，随着三维封装体积不断减小、热流密度越来越高，封装内部的热-力、力-电耦合效应愈发突出，直接影响其可靠性。本项目着眼于当前三维封装中存在的耦合机理不明晰、测试手段不完善和故障判别不准确等核心关键瓶颈问题，首先开展了典型三维封装结构中电-热-机多物理场耦合机理研究，揭示了电-热-机耦合场的稳态和动态分布规律，分析了三维封装的缺陷生长和裂纹扩展过程，以及缺陷对射频传输特性的影响。其次，通过深入研究多模态高精度时空去耦应力测试方法，研制出了高带宽、高精度和高空间分辨率的动态微形变测试系统，实现了三维封装形变场分布特性的精确表征，提供了一种可靠的三维封装测试手段。然后，借助于自研制的动态微形变测试系统，开展了基于多模态测试数据融合算法的三维封装故障诊断研究，构建了基于粒子滤波算法的三维封装故障预测模型，达到了在设计阶段为具有高可靠性要求三维封装系统可靠性设计提供指导的目的。此外，在圆满完成上述既定研究内容的基础上，还发现了三维封装功率模块中的瞬态弹性波现象并进行了深入研究，厘清了三维封装功率模块中瞬态弹性波的本质来源，有望为三维封装结构的故障判别和寿命预测提供一种全新的思路。