低维材料在温、湿环境下力学行为与断裂力学问题实验研究

We have mainly studied the low-dimensional film materials and analyzed their mechanism by means of experimental measurement techniques of micro mechanics in this project. Some typical film materials applied in microelectronics, chemical industry and material fields have been used as our objects of study and several unsolved basic mechanical problems in the application of these materials have been focused on. Some progresses have been made. For example, an experimental technique of optical mechanics, which can be used in the measurement of large deformation of film materials, has been proposed and established; the existing micro-dimensional measurement techniques of experimental mechanics have been improved and an effective means for the experimental analysis of low-dimensional materials has been given. The curves of the relation between the fracture toughness of coin foils applied in micro-electronics field and their thickness have been measured and calculated quantitatively and, moreover, the influence of micro-structure and dimensional effect on the fracture toughness of coin foils have been analyzed. Cooperating with Sweden National Material Institute, we have made experimental stress analysis on conductive adhesive films under temperature and humidity of environment. Furthermore, we have established their one-dimension constitutive relations and, for the first time, we have proved the existence of moisture-time superposition principle in the macromolecule materials experimentally, etc.

本项目以微米尺度的细丝和薄膜为几何构形，以微电子封装和化工中应用的几种典型的新型低维材料为研究对象，以细观力学实验测量和分析建模为主要手段，以研究此类材料三项尚未解决的重要力学行为作为主要研究目标，它们是：低维材料在温、湿环境因素联合作用下的力学性能与破坏分析；低维材料的流变特性与一维本构关系描述；薄膜材料断裂韧性测量。