二氧化硅基混合集成光量子芯片基础研究

This project is targeted at the fundamental research of hybrid silica-based photonic quantum chip by combing technology of silicon photonics and femtosecond laser direct-writing, in order to find approaches to currently challenging issues in quantum information science, including the limitations in bulk optics based quantum systems, the bottlenecks for developing large-scale quantum system and the problems of integrating quantum systems into photonic quantum chip. With our accomplished two types of platform, the physical mechanism of hybrid silica-based photonic quantum chip would be thoroughly studied. Key technical goals are to be realized, including low loss (<0.1dB/cm), ultrahigh precision (parameter uncertainty <5%), high coupling efficiency (>90%), high integration (channel number>400) and three-dimensional integration (layer number>20). Apart from that, this project is to study the issues of compatibility when chips are applied to satellite-based floating platform in the quantum satellite program, to quantum communication network, and to large-scale Boson sampling quantum computing program. Our ream has laid a solid foundation on the research of photonic quantum chip, quantum communication and quantum computing. We have been dedicated to quantum information technology and quantum system integration, and demonstrate strong competency for fulfilling the project of a high quality.

本项目从宏观光学量子系统的局限性、大规模量子信息技术的发展瓶颈、以及量子系统走向芯片化集成化面临的问题为出发点，深入攻关二氧化硅基的硅平面工艺和飞秒激光直写工艺，发展工艺间兼容的关键技术，研发二氧化硅基混合集成光量子芯片，实现优势互补。揭示混合集成光量子芯片关键参数相关的物理机制，实现极低损耗（<0.1dB/cm）、超高精度（参数不确定度 <5%）、高耦合效率（>90%）、高集成度（通道数>400）和三维集成（层数>20）的关键技术指标。在此基础上，以国家重大科学工程的需求为牵引，研究光量子集成芯片与卫星浮动载台、地面量子通信网络和多光子纠缠源的兼容性问题，为量子卫星、量子通信网络和大规模玻色采样量子计算的芯片化集成化应用奠定基础。本研究团队在光子集成芯片、量子通信和量子计算领域具有很好的研究基础，而且专注于量子信息技术及其集成化研究，有能力高质量完成本项目。

我们以国家重大科学工程的需求为牵引，针对宏观光学量子系统的局限性、大规模量子信息技术的发展瓶颈、以及量子系统走向芯片化集成化面临的问题，我们将二氧化硅基的硅平面工艺和飞秒激光直写工艺相结合，实现光量子原型器件的反复修改和快速制造，并实现新颖的三维光子回路和三维高密度集成。虽然飞秒激光直写光波导在光量子器件的原型器件制备上已经取得了显著的成功，但是该技术在未来大规模芯片制备中取得普遍应用仍有待突破若干技术瓶颈，包括光波导损耗的进一步降低、在芯片上进一步实现光源与探测单元的集成等，仍需深入和系统的研究。针对上述关键瓶颈问题和应用基础问题，我们开展了持续不断的研发攻关，在三维集成光学波导阵列、大规模量子演化器件、模拟量子算法应用等方面取得了一系列重要突破，实现了多种经典计算机无法模拟的量子物理实验，所涉及的光量子芯片的空间复杂程度不断提高。当前，飞秒激光直写光波导已成为制备三维光量子芯片的重要途径，在量子调控与量子信息中显示出重要的应用前景。