可重构集成微波光子射频前端器件基础研究

Integrated microwave photonics has advantages of the electronics technology in ubiquity and flexibility, and the integrated photonics in broadband, high speed and low power consumption, which can be used to break the bottleneck of information system in data rate and energy consumption. The purpose of this project is to investigate the reconfigurable integrated microwave photonic RF front-end device. Through theoretical and experimental studies on hybrid integration, key scientific and technical problems are going to be solved, such as compatibility between different materials, waveguide mode matching, high frequency signal parasitic and optical mode cooperative control. These researches will lay a foundation for integrated microwave photonic RF front-end device. The proposed integrated microwave photonic RF front-end has the advantage of low complexity, simple operation, strong reconfigurability and high density integration.

集成微波光子技术同时具备了电子技术泛在、灵活的优点和光子集成技术宽带、高速、低功耗的优点，是解决信息系统面临的速率和能耗瓶颈的必由之路。本项目对可重构集成微波光子射频前端器件开展研究。通过对Si基和InP基有源无源器件混合集成的理论基础和实验研究，解决不同材料制备工艺兼容性、波导模式匹配、高频电信号寄生、光模式协同控制等关键科学问题和技术难点，为一体化集成微波光子射频前端器件实现打下基础。所提出的集成射频前端器件具有复杂度低、操作简单、可重构性强、高密度集成等优点。

集成微波光子技术同时具备了电子技术泛在、灵活的优点和光子集成技术宽带、高速、低功耗的优点，是解决信息系统面临的速率和能耗瓶颈的必由之路。本项目对可重构集成微波光子射频前端器件开展研究。通过对Si基和InP基有源无源器件混合集成的理论基础和实验研究，解决不同材料制备工艺兼容性、波导模式匹配、高频电信号寄生、光模式协同控制等关键科学问题和技术难点，为一体化集成微波光子射频前端器件实现打下基础。所提出的集成射频前端器件具有复杂度低、操作简单、可重构性强、高密度集成等优点。