后固化型低介电含氟聚芳醚聚合物材料

High performance low-k polymer materials have important practical application background and scientific value in the field of large scale integrated circuits and high density packaging substrates. These materials are expected to have outstanding properties such as high Tg, good heat resistance, excellent thermal stability, low water absorption, low dielectric constant and dielectric loss. This project is to prepare a series of post curable fluoro-polyarylene ethers to achieve high performance low dielectric polymer materials with large free volume and high cross-linking density. The rigid long side group of benzocyclobutene is introduced into the polymer, which can be post-cured by heat treatment. The permittivity of the polymer can be further reduced by introducing building blocks containing fluorine such as trifluoromethyl, octafluorocyclopentene. In addition, a series of fluorinated polyaryl ether containing 1,3-disilacyclobutane is also designed, which can be crosslinked by heating at 200~300oC . Through the optimization of synthetic monomer structure, high free volume size and high crosslinking density of the polymer materials with optimized mechanical, thermal properties and dielectric properties will be achieved. This research will provide new ideas and methods for the development of high performance low-k materials.

高性能低介电聚合物材料在大规模集成电路以及高密度封装基板等领域有着重要的应用背景和科学价值。这类材料需要有良好的耐热性、优异的热稳定性、低吸水率、以及低的介电常数和介电损耗。本课题拟通过分子设计和合成制备一系列可后固化的含氟聚芳醚聚合物，以增大聚合物材料自由体积的同时提高交联密度为策略，实现高性能低介电聚合物材料的制备。在聚芳醚聚合物体系中，引入苯并环丁烯官能化的刚性长侧基，可进行热处理实现后固化交联。引入含氟的构筑基元如三氟甲基、八氟环戊烯，降低聚合物的介电常数。还设计了一系列含硅杂环丁烷的含氟聚芳醚，可在200~300摄氏度加热下实现交联。通过调控合成聚合物单体的结构，实现聚合物材料的交联密度与自由体积尺寸调控并优化，平衡材料的力学、热学性能以及介电性能，最终实现高性能低介电聚合物材料的制备。本课题将为低介电聚合物材料的制备和开发提供新的思路和方法。

在高速通信行业中，低介电常数（low-k）介质材料对于提高信号传输速度、降低功率损耗至关重要。电介质材料在具备低介电、低损耗性能的同时，还应具有高热稳定性、高玻璃化转变温度和良好的机械性能。因此如何降低材料介电常数的同时，保持优异的热稳定性、高玻璃化转变温度是材料设计和合成的难题。本项目基于本项目针对高性能聚合物材料，合成了多种不同结构的苯并环丁烯聚合物材料，特别是具有苯并环丁烯侧基的聚芳醚、聚酰亚胺，表现出了优异的热性能和低介电性能。另外，还设计并合成了高含氟量聚酰亚胺。所有材料中介电常数最低为2.4。我们还合成了酚羟基官能化的高含氟量的超支化聚芳醚。其中酚羟基官能化的高含氟量的超支化聚芳醚可用于固化环氧树脂，降低环氧树脂的介电常数。并通过动态力学分析、热失重、热机械分析等手段分析了材料结构与性能的关系。本项目的研究为在提升聚合物材料热稳定性的同时调控其介电性能提供了新的策略，为5G通讯以及下一代通讯材料的开发提供了新的思路。