用于同步辐射的硅像素探测器关键技术研究

Under the circumstance that the brightness in synchrotron radiation experiments is increasing constantly, it needs detector with higher measurement capability to coordinate. Nowadays, silicon pixel detectors can meet the requirements of synchrotron radiation experiments. While the technology in our country is almost completely unavailable, it has to all rely on import. In another word, the development of silicon pixel detectors in China has fallen behind the foreign countries for almost two decades. Therefore, it is substantial and urgent to develop silicon pixel detectors. The development consists of the following parts: silicon pixel sensor array, front-end electronics, package and back-end data processing. Following the way of solving the key problem first, studies of some most important parts are included in this project, and the study of the testing system is also included. Among which, silicon pixel sensor array and front-end electronics are determined to design by ourselves, which can solve the problem of low-noise array measurement and data read-out. For another, package part is determined to research bump bonding and TSV technology, which can realize effective package of high density silicon pixel sensor array and front-end electronics chip. Finally, one complete module with sensor and ASIC will be made, and it will be tested by the testing system. We hope that we can make important contribution to the promotion of our country’s synchrotron radiation development and high-quality operation through this project.

同步辐射实验在光亮度在不断增加的情况下，需要有更高测量能力的探测器配合。目前，硅像素探测器可以很好满足同步辐射实验的要求，但是国内几乎完全空白，全部需要进口。可以说，硅像素探测器的发展中国与国外比落后了二十年，因此，发展硅像素探测器刻不容缓。硅像素探测器的几个组成部分包括：硅像素传感器阵列、前端电子学、封装和后端数据处理。从首先解决最关键问题的思路出发，项目中针对最重要的几个部分进行研究，并且把测试系统也考虑在内。其中，传感器阵列和前端电子学均自行设计，解决阵列式低噪声测量和读出问题；封装部分拟研究bump bonding技术和TSV技术，实现硅像素传感器阵列与前端电子学芯片的高密度有效封装；最终完成一个传感器和前端电子学封装好的模块，并在测试系统上进行测试。希望通过本项目的研究为促进我国同步辐射技术的发展和高质量运行做出贡献。

同步辐射实验在光亮度在不断增加的情况下，需要有更高测量能力的探测器配合。目前，硅像素探测器可以很好满足同步辐射实验的要求，但是国内几乎完全空白，全部需要进口。可以说，硅像素探测器的发展中国与国外比落后了二十年，因此，发展硅像素探测器刻不容缓。硅像素探测器的几个组成部分包括：硅像素传感器阵列、前端电子学、封装和后端数据处理。从首先解决最关键问题的思路出发，项目中针对最重要的几个部分进行研究，并且把测试系统也考虑在内。其中，传感器阵列和前端电子学均自行设计，解决阵列式低噪声测量和读出问题；封装部分拟研究bump bonding技术和TSV技术，实现硅像素传感器阵列与前端电子学芯片的高密度有效封装；最终完成一个传感器和前端电子学封装好的模块，并在测试系统上进行测试。通过几年的努力，顺利完成了项目研究，在提升我国此方面技术储备的同时，为后期同步辐射成像设备国产化奠定了基础.