孔洞的填充和隔离对金属环绕串通晶体硅太阳能电池性能的影响

The metal wrap through (MWT) solar cells have attracted much attention due to its less shading loss than conventional solar cells'. The via hole connecting the front and back electrode is an importand component of the MWT solar cells. The fill factor of MWT solar cell is influenced by the via filling and the isalation layer in the via hole. We propose that new technologies, such as light-induced plating and plasma-enhanced chemical vapor deposition, should be incoperated into via filling and isolation rather than developping the paste, and the new technologies should be industrially feasible. The impact of via filling and isolation on Rs and Rsh will be studied. Moreover，the fill factor change will be studied, which is induced by the microstructure of the metallized area of the via and the interface of metallized part and the silicon. The fill factor and Voc of MWT will be enhanced by the optimized process in order to provide instructions on study and production of MWT solar cells.

金属环绕串通(MWT)太阳能电池具有前表面遮光损失小的优点，是目前太阳能电池研发的热点。连接前表面电极和背表面栅线的孔洞是此类电池的关键结构之一，孔洞内部金属的填充及内表面的隔离对电池填充因子具有重要的影响。本项目紧密联系太阳能电池的生产，将光诱导镀等方法应用到MWT电池的孔洞填充，并通过等离子体辅助化学气相沉积等手段在通孔内表面生长隔离层，系统研究孔洞的填充和隔离对MWT电池的串、并联电阻的影响。此外，还将对孔洞内金属与半导体接触界面的微观结构进行表征，深入研究其对MWT电池填充因子的影响。通过系统对比和分析，对MWT电池的工艺进行优化，提高MWT电池的开路电压和填充因子，为MWT电池的生产和研发提供参考。

金属环绕串通(MWT)太阳能电池具有前表面遮光损失小的优点，是目前太阳能电池研发的热点。连接前表面电极和背表面栅线的孔洞是此类电池的关键结构之一，孔洞内部金属的填充及内表面的隔离对电池填充因子具有重要的影响。本项目紧密联系太阳能电池的生产，将光诱导镀等方法应用到MWT电池的孔洞填充，并通过等离子体辅助化学气相沉积等手段在通孔内表面生长隔离层，系统研究孔洞的填充和隔离对MWT电池的串、并联电阻的影响。此外，还将对孔洞内金属与半导体接触界面的微观结构进行表征，深入研究其对MWT电池填充因子的影响。通过系统对比和分析，对MWT电池的工艺进行优化，提高MWT电池的开路电压和填充因子，为MWT电池的生产和研发提供参考。